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Flexible AI Chip Integrating 10,628 Transistors Debuts, Paving the Way for Bendable Intelligence
2026-03-20
Chinese researchers announced a major breakthrough on January 29 in a paper published in Nature, unveiling a fully flexible artificial intelligence chip that provides critical hardware support for applications such as wearable health monitoring devices and flexible robotics.
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SK hynix Reportedly Develops HBM4 System-Level Testing Equipment, Deepens TSMC Collaboration
2026-03-20
Competition in next-generation memory is heating up, and SK hynix is reportedly taking another step to reinforce its leadership in HBM4. According to The Elec, the company has successfully developed system-level testing equipment for its HBM4. The equipment enables memory makers to identify defects that may arise after HBM is integrated with AI chips—an evaluation process that had previously been handled by foundries.
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AI Power Demand Drives HVDC Shift in Data Centers; Full-Stack Integration Emerges as Key
2026-03-20
As AI computing demand surges and energy consumption challenges intensify, power supply solutions are drawing growing attention across the industry. According to TrendForce on TechNews, the sector is shifting away from traditional architectures toward high-voltage direct current (HVDC) power systems, while also exploring forward-looking technologies ranging from HVDC Power Racks to solid-state transformers (SSTs).
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NAND Giant YMTC Reportedly Debuts First Commercial PCIe 5.0 SSD Using In-house Xtacking Flash
2026-03-20
Amid the ongoing global memory shortage, Chinese memory makers are pushing aggressively to capture a bigger slice of the market. According to Tom’s Hardware, YMTC, the nation’s NAND heavyweight, has officially entered the PCIe 5.0 SSD arena with its first commercial offering, the PC550.
